Job Description

Senior Hardware Manager

Join Nokia's Hardware team and be responsible for developing and designing high-speed boards. You'll manage and lead Electrical and Mechanical/thermal engineers to deliver complex high-speed telecom products. Your projects will include developing new products, researching new technologies, sustaining engineering on existing products, and engineering related to other company project activities.

Major Responsibilities

• Manage the daily activities of a team of talented Board designers, mechanical, and thermal engineers.
• Design, test, validate, and release Chassis and Printed Circuit Boards (PCBs) containing digital and mixed-signal circuits for deployment into the telecommunications market. Duties may also include existing product engineering support and documentation.
• As a hands-on Hardware leader, provide guidance to board designers designing high-speed boards. You'll be responsible for PCBA design, including schematics capture, layout, and full EDVT.
• As a hands-on Thermal and Mechanical engineering leader, you'll design high-speed line cards and telecom Chassis.
• Work from product concept to production with minimal supervision.
• Contribute to the definition of product features considering mechanical, electrical, thermal tradeoffs, customer needs, and company goals.
• Have a good understanding of thermal solutions, including complex heatsink design, 2D/3D vapor chambers, TPCM materials, etc.
• Follow through and energetically support the introduction of new designs to production.
• Drive designs from conception through manufacturing production, including architecture requirements, functional specifications, design, prototypes, hardware bring-up, and verification.
• Work with cross-functional teams (SW, FW, SDVT, Diag, MFG, Optical, Architecture).
• Support the product through pre- and post-production releases.
• Work with ODM vendors to review design schematics and EDVT reports and provide guidance as needed.

Experience Required

• BSME or MSME preferred with over 10 years of experience as a technical leader managing a hardware team. Responsibilities include hiring, coaching, and setting development goals for the team.
• Experience with ARM-based processors, FPGAs, high-speed Ethernet Serdes, and power supplies is essential.
• Experience with tolerance analyses, shock and vibration testing, and fiber management is also required.
• A good understanding of Ethernet (CAUI4, 200GAUI-4, 400GAUI-8, FlexE, 800G) and OTN (OTU4) Standards is a plus.
• Experience with high-speed SerDes and applicable layout constraints (26G, 56G) is desirable.
• Knowledge of PCB fabrication, fab & assembly design rules, Via Back drilling, PCB sequential lamination process, and product integration with mechanical components is required.
• Experience in thermal design of high-powered, densely packed circuit packs is necessary, and the ability to provide cooling solutions for high-power ASICs is essential.
• Good knowledge of tools such as Cadence, CREO, and FloTherm is required.
• Familiarity with NEBS, ETSI, ANSI, and acoustic requirements is beneficial.
• Fluent in written and verbal English is required.
• The ability to work independently and across multiple time zones is considered a plus.

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